| 发明名称 | Chip stacking packaging structure | ||
| 摘要 | A chip stacking packaging structure is provided for achieving high-density stacking and improving a heat dissipation efficiency of the chip stacking packaging structure. The chip stacking packaging structure includes a main substrate and at least one stacking substrate in which a main chip is disposed in the main substrate, at least one stacking chip is disposed on the stacking substrate, and a side edge of the stacking substrate is disposed on the main substrate, so that the stacking chip is connected to the main chip. | ||
| 申请公布号 | US9257358(B2) | 申请公布日期 | 2016.02.09 |
| 申请号 | US201414552674 | 申请日期 | 2014.11.25 |
| 申请人 | Huawei Technologies Co., Ltd. | 发明人 | Liu Weifeng |
| 分类号 | H01L23/34;H01L23/367;H01L23/00;H01L25/065;H01L25/10;H01L23/538;H05K1/18;H05K3/46;H01L25/18;H01L23/373 | 主分类号 | H01L23/34 |
| 代理机构 | Conley Rose, P.C. | 代理人 | Conley Rose, P.C. ;Rodolph Grant;Beaulieu Nicholas K. |
| 主权项 | 1. A chip stacking packaging structure comprising: a main substrate; and at least one stacking substrate, wherein a main chip is disposed in the main substrate, wherein at least one stacking chip is disposed on the stacking substrate, wherein a side edge of the stacking substrate is disposed on the main substrate, so that the stacking chip is connected to the main chip, wherein the stacking chip is disposed on a surface of the stacking substrate, and wherein the main chip is disposed inside the main substrate. | ||
| 地址 | Shenzhen CN | ||