Through-assembly via modules and methods for forming the same

摘要

A discrete Through-Assembly Via (TAV) module includes a substrate, and vias extending from a surface of the substrate into the substrate. The TAV module is free from conductive features in contact with one end of each of the conductive vias.

主权项

1. A method comprising:
forming a plurality of through-vias extending from a top surface of a substrate in a wafer into the substrate; forming a plurality of through-strips extending from the top surface of the substrate into the substrate, wherein the plurality of through-strips is parallel to each other, and wherein lengths of the plurality of through-strips are greater than widths of the plurality of through-strips; forming a plurality of redistribution lines over and connected to the plurality of through-vias; performing a backside grinding on a back surface of the substrate; and performing a die-saw on the wafer to cut the wafer into a plurality of dies.