| 主权项 |
1. A method of producing coated substrates, the method comprising:
a) providing a sputtering line including at least three adjacent sputtering bays each adapted for depositing dielectric film and each containing a reactive sputtering atmosphere, at least one of said bays being a transition bay equipped with two or more sputtering targets of which at least two carry different sputterable materials, wherein the first target in the transition bay carries the same sputterable material as the last or only target in a preceding bay, and wherein the last target in the transition bay carries the same sputterable material as the first or only target in a subsequent bay, wherein all of the targets in the transition bay share the reactive sputtering atmosphere; and b) conveying a substrate through said sputtering line over rollers defining a path of substrate travel from one bay to the next and sputtering said targets to deposit upon the substrate a coating comprising a graded film region, wherein the graded film region is deposited as a film comprising a substantially continuously decreasing concentration of a first dielectric material and a substantially continuously increasing concentration of a second dielectric material, wherein the first and second dielectric materials are different materials having refractive indexes that are substantially the same such that the first graded film region transitions from one dielectric material having a given refractive index to another dielectric material having substantially the same refractive index to provide a coating sputtered from said targets in said three adjacent bays having a substantially homogenous refractive index. |
