发明名称 |
CMOS-MEMS integrated flow for making a pressure sensitive transducer |
摘要 |
A sensor is made up of two substrates which are adhered together. A first substrate includes a pressure-sensitive micro-electrical-mechanical (MEMS) structure and a conductive contact structure that protrudes outwardly beyond a first face of the first substrate. A second substrate includes a complementary metal oxide semiconductor (CMOS) device and a receiving structure made up of sidewalls that meet a conductive surface which is recessed from a first face of the second substrate. A conductive bonding material physically adheres the conductive contact structure to the conductive surface and electrically couples the MEMS structure to the CMOS device. |
申请公布号 |
US9254997(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201314013080 |
申请日期 |
2013.08.29 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Cheng Chun-Wen;Liang Kai-Chih;Chu Chia-Hua |
分类号 |
H01L29/66;B81C1/00 |
主分类号 |
H01L29/66 |
代理机构 |
Eschweiler & Associates, LLC |
代理人 |
Eschweiler & Associates, LLC |
主权项 |
1. A sensor, comprising:
a first substrate including a conductive layer vertically arranged between a semiconductor layer and a conductive contact structure, wherein the conductive layer includes stationary regions and a movable region extending laterally between the stationary regions, wherein the movable region includes a plurality of recesses extending downwardly into an upper side of the conductive layer, wherein some of the plurality of recesses taper inwardly to adjoin openings extending through perforated regions in a lower side of the conductive layer and other of the plurality of recesses terminate at an upper surface of a conductive membrane of the conductive layer that is laterally arranged between the perforated regions, wherein the conductive contact structure protrudes outwardly from a lower side of the conductive layer, beyond a face of the first substrate, and wherein the conductive contact structure is electrically coupled to a pressure-sensitive micro-electrical-mechanical (MEMS) structure on the first substrate; a second substrate including a receiving structure having a conductive surface which is recessed from a face of the second substrate by sidewalls that bound the conductive surface, wherein the conductive surface is electrically coupled to a complementary metal oxide semiconductor (CMOS) device on the second substrate; and a conductive bonding material to physically adhere the conductive contact structure to the conductive surface and to electrically couple the MEMS structure to the CMOS device. |
地址 |
Hsin-Chu TW |