| 发明名称 | Method of forming diamond conditioners for CMP process | ||
| 摘要 | A method for making a conditioner disk used in a chemical mechanical polishing (CMP) process comprises applying a first layer of at least one binder over a substrate; disposing a plurality of diamond particles on the first layer of the at least one first binder at the plurality of locations; and fixing the plurality of diamond particles to the substrate by heating the substrate to a raised temperature and then cooling the substrate. The plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk is used in a CMP process. | ||
| 申请公布号 | US9254548(B2) | 申请公布日期 | 2016.02.09 |
| 申请号 | US201213455448 | 申请日期 | 2012.04.25 |
| 申请人 | Taiwan Semiconductor Manufacturing Co., Ltd. | 发明人 | Chao Yen-Chang;Chen Kei-Wei;Wang Ying-Lang |
| 分类号 | B24B53/017;B24D3/06;B24D3/28;B24D18/00 | 主分类号 | B24B53/017 |
| 代理机构 | Duane Morris LLP | 代理人 | Duane Morris LLP |
| 主权项 | 1. A method for making a conditioner disk used in a chemical mechanical polishing (CMP) process, comprising: applying a first layer of at least one binder over a substrate; disposing a plurality of diamond particles on the first layer of the at least one first binder at a plurality of locations; fixing the plurality of diamond particles to the substrate by heating the substrate to a raised temperature and then cooling the substrate; and coating a second layer of at least one second binder over the substrate, wherein at least one top portion of each of the plurality of diamond particles protrudes out of the second layer of at least one second binder and is exposed, and the plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk contacts a flat surface. | ||
| 地址 | Hsin-Chu TW | ||