发明名称 低熱抵抗を有する低インダクタンスのフレックス・ボンド
摘要 An electronic circuit with low inductance connections is disclosed. The electronic circuit includes a ground plane and a flex circuit. The flex circuit having a first surface generally facing the ground plane and a second surface opposite to the first surface. The flex circuit also having a flexible bridge defined thereof. The electronic circuit further includes a first electronic device communicatively coupled to the second surface of the flex circuit, a second electronic device communicatively coupled to the second surface of the flex circuit, and at least one conductive trace defined on the second surface of the flex circuit and extending along the flexible bridge. One end of the at least one conductive trace is configured for receiving an outbound current from the first electronic device and another end of the at least one conductive trace is communicatively coupled to the second electronic device through a vertical interconnect access.
申请公布号 JP5855068(B2) 申请公布日期 2016.02.09
申请号 JP20130219797 申请日期 2013.10.23
申请人 エルエスアイ コーポレーション 发明人 ドナルド・アール・ラチュレル;サイード・イー・アブデリ;ピーター・キス;ジェームズ・エフ・マクドナルド;ロス・エス・ウィルソン
分类号 H05K1/02;H05K1/18 主分类号 H05K1/02
代理机构 代理人
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