PoP structures including through-assembly via modules

摘要

A device includes a Through-Assembly Via (TAV) Module, which includes a substrate, a plurality of through-vias penetrating through the substrate, and a second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias. A polymer includes a first portion between and contacting sidewalls of the first package component and the TAV module, a second portion disposed between the first plurality of metal posts, and a third portion disposed between the second plurality of metal posts. A first plurality of Redistribution Lines (RDLs) is underlying a bottom surface of the second and the third portions of the polymer. A second plurality of RDLs is over the first package component and the TAV module. The first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module.

主权项

1. A device comprising:
a first package component; a first plurality of metal posts at a bottom surface of the first package component and electrically coupled to the first package component; a Through-Assembly Via (TAV) Module comprising:
a substrate;a strip-shaped via in the substrate, wherein the strip-shaped via is electrically floating;a plurality of through-vias penetrating through the substrate, wherein each of the plurality of through-vias comprises a straight sidewall extending from a top surface to a bottom surface of the substrate; anda second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias; a polymer comprising:
a first portion between and contacting sidewalls of the first package component and the TAV module;a second portion disposed between the first plurality of metal posts; anda third portion disposed between the second plurality of metal posts; a first plurality of Redistribution Lines (RDLs) underlying a bottom surface of the second and the third portions of the polymer; and a second plurality of RDLs over the first package component and the TAV module, wherein the first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module.