| 发明名称 | Wiring board and method for manufacturing the same | ||
| 摘要 | A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad. | ||
| 申请公布号 | US9258897(B2) | 申请公布日期 | 2016.02.09 |
| 申请号 | US201213484381 | 申请日期 | 2012.05.31 |
| 申请人 | IBIDEN CO., LTD. | 发明人 | Ishihara Teruyuki;Noguchi Hidetoshi;Futamura Hirofumi |
| 分类号 | H05K1/02;H05K1/18;H05K3/34;H05K3/46 | 主分类号 | H05K1/02 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A wiring board, comprising: a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on an opposite side of the first-surface side, wherein the laminated structure has a first-surface side pad formed on a bottom surface of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, laminated structure has a first opening portion and a second opening portion formed on the second-surface side, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion such that the back face of the recessed portion does not include a pad on the second-surface side of the laminated structure, and the second opening portion has a depth which is a same as or less than a thickness of the solder resist. | ||
| 地址 | Ogaki-shi JP | ||