Package substrate and die spacer layers having a ceramic backbone

摘要

A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

主权项

1. An integrated circuit package substrate comprising:
a composite layer having an upper surface and a lower surface, the composite layer including a plurality of spaced-apart ceramic wells comprising a first ceramic material, the plurality of ceramic wells situated within a metal layer and lying within a plane with at least some of the ceramic wells being separated by portions of the metal layer that extend between the upper and lower surfaces, the plurality of ceramic wells comprising a bottom wall portion and a sidewall portion, the side wall portion extending upward from the bottom wall portion to the upper surface; and a filler material disposed within at least some of the ceramic wells.