发明名称 |
Manufacturing method for transparent substrate |
摘要 |
There is provided a manufacturing method for a transparent substrate excellent in bending property, flexibility, impact resistance, and external appearance. A manufacturing method for a transparent substrate according to an embodiment of the present invention includes: a step A of applying a thermoplastic resin (A) composition solution onto a support backing having solvent permeability to form an applied layer; a step B of attaching at least one surface of an inorganic glass and the applied layer to each other via an adhesive composition to form a laminate; a step C of subjecting the laminate to a first heat treatment to reduce an amount of a solvent remaining in the applied layer to a predetermined amount; and a step D including peeling the support backing from the laminate and subjecting the resultant to a second heat treatment to dry the applied layer, thereby forming a thermoplastic resin layer. |
申请公布号 |
US9254627(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201113640444 |
申请日期 |
2011.04.28 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
Hattori Daisuke;Murashige Takeshi;Kameyama Tadayuki |
分类号 |
B44C1/17;B32B17/06;B32B7/06;B32B17/10;B29C65/00;B32B38/00;G02F1/1333;B32B7/12;B29L9/00;B29L7/00;B29C65/48;B29L31/34;B32B37/00;B32B37/12;B32B38/10;B32B38/16 |
主分类号 |
B44C1/17 |
代理机构 |
Westerman, Hattori, Daniels & Adrian, LLP |
代理人 |
Westerman, Hattori, Daniels & Adrian, LLP |
主权项 |
1. A manufacturing method for a transparent substrate, comprising:
a step A of applying a thermoplastic resin (A) composition solution onto a support backing having solvent permeability to form an applied layer; wherein the thermoplastic resin (A) composition solution comprises a solvent and a thermoplastic resin (A); then a step B of attaching at least one surface of an inorganic glass and the applied layer to each other via an adhesive composition to form a laminate; then a step C of subjecting the laminate to a first heat treatment to reduce an amount of the solvent to a predetermined amount; and then a step D of peeling the support backing from the laminate and then subjecting the resultant to a second heat treatment to dry the applied layer, thereby forming a thermoplastic resin layer, wherein the adhesive composition comprises a solvent, and the solvent in the adhesive composition exhibits the property of dissolving thermoplastic resin (A) contained in the thermoplastic resin (A) composition solution. |
地址 |
Ibaraki-shi JP |