| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat transfer device sufficient for moving away the heat from a component, in a situation where down-sizing of an electric circuit continues.SOLUTION: A heat transfer device 100 includes a body 101 defining a fluid inlet 103 and a fluid outlet 105, and a plurality of channels 107 defined in the body 101 where the fluid inlet 103 and fluid outlet 105 are in fluid communication. The channels 107 are interwoven between the fluid inlet 103 and fluid outlet 105, and isolated fluidly from each other. The body 101 can define a single matrix for isolating the channels 107 fluidly from each other, between the fluid inlet 103 and fluid outlet 105.SELECTED DRAWING: Figure 1 |
