| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable maleimide resin which forms a high heat resistant maleimide network structure that is always useful for curing various resins, in particular, for curing epoxy and maleimide resins by reacting an anion polymerization catalyst having high basicity with a maleimide compound, and has excellent dielectric characteristics; and a curable resin composition using the same and a cured product of the same.SOLUTION: A curable maleimide resin is formed by reacting a compound having at least one maleimide group in one molecule with an anion polymerization catalyst, and contains a linear structure or a maleimide cyclic trimer structure.SELECTED DRAWING: None |
