| 摘要 |
PROBLEM TO BE SOLVED: To provide a polisher, a polisher set and a polishing method which can reduce the polishing rate of stopper material used in a substrate surface flattening step of a semiconductor element manufacturing process.SOLUTION: A polisher comprises water, an abrasive grain comprising hydroxide of a tetravalent metal element, and a nonionic compound with a structure represented by formula (I). In the CMP technique of flattening SIT insulation material, premetal insulation material, interlayer insulation material and others, a polishing rate in polishing insulation material with a stopper is reduced. In the formula, m and n are an integer of 1 or more and (AO) is alkylene oxide.SELECTED DRAWING: None |
