| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of package wafer capable of shortening the time required for processing, while keeping high processing accuracy.SOLUTION: A cutting step includes a deviation amount measurement step for detecting a cut groove (25) formed by cutting, and an exposure key pattern closest to a division line (15) corresponding to the cut groove, at a predetermined timing, and measuring the difference between the distance from the cut groove to the exposure key pattern, and the distance from a division line corresponding to a cut groove registered in a registration step to a closest key patten (19) as a deviation amount, a correction step for correcting the feed amount of indexing feed depending on the deviation amount, and a feed indexing step for feed indexing a cutting blade (34) with a feed indexing amount corrected in the correction step.SELECTED DRAWING: Figure 4 |
