发明名称 CHUCK TABLE AND LASER CUTTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent adhesion of processed waste to chips after cutting a plate-like workpiece.SOLUTION: A chuck table (20) is used in cutting for cutting a plate-like workpiece (W) into individual chips (C). The chuck table (20) includes: a base member (21) having an outer periphery holding section (27) for sucking and holding an outer peripheral side of the plate-like workpiece (W) formed in a projection section (24) surrounding a central recess (23); and a holding block (22) disposed corresponding to each chip so as to hold the chips after dividing the plate-like workpiece (W) in the recess (23) of the base member (21). In the base member (21), an air intake port (36) is formed to suck air between the base member (21) and the holding block (22) and is configured to discharge processed waste entered between the base member (21) and the holding block (22) during cutting to the outside of the chuck table (20).SELECTED DRAWING: Figure 4
申请公布号 JP2016022483(A) 申请公布日期 2016.02.08
申请号 JP20140146049 申请日期 2014.07.16
申请人 DISCO ABRASIVE SYST LTD 发明人 AIKAWA RIKI;SATO ATSUSHI
分类号 B23K26/10;B23K26/14;B23K26/16;B23K26/38;H01L21/301 主分类号 B23K26/10
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