| 摘要 |
PROBLEM TO BE SOLVED: To connect a power semiconductor chip and other electrical component, sandwiched between two insulation wiring boards, electrically with high yield.SOLUTION: A mounting method of a power semiconductor chip includes a step of bonding one end of bumps 61, 62 to the source electrode 41 and gate electrode 43 of a power transistor chip 4, a step of bonding the other end of the bumps 61, 62 to conductor foils 21, 23 on an insulation board 2, a step of connecting the anode electrode 51 of a reflux diode chip 5 with the conductor foil 21 on the insulation board 2 by a bump 63, a step of compressing between the insulation board 2 and the drain electrode 42 of the power transistor chip 4 and the cathode electrode 52 of the reflux diode chip 5, and deforming the bumps 61, 62, 63 plastically so as to arrange the height of the drain electrode 42 and cathode electrode 52 measured from the first principal surface 2a, and a step of bonding the drain electrode 42 and cathode electrode 52 to a conductor foil 31 on an insulation board 3 by means of a solder 7.SELECTED DRAWING: Figure 1 |
