发明名称 CURING MONITORING DEVICE AND CURING MONITORING METHOD
摘要 PROBLEM TO BE SOLVED: To suppress a degradation in the accuracy of calculating the curing degree of resin.SOLUTION: A curing monitoring device 1 has a light source 12 for irradiating an object to be observed that includes a resin 20 and a base substance 21 in contact with the resin 20 with excitation light. The curing monitoring device 1 further has a camera 15 for imaging the object to be observed. The curing monitoring device 1 further has in the optical path of the object to be observed and camera 15, a filter a and a filter b transmitting lights which are included in the wavelength region of fluorescence that the resin 20 emits by irradiation with the excitation light and which differ in wavelength band from each other. The curing monitoring device 1 further has in the optical path of the object to be observed and camera 15, a filter c transmitting the light of a wavelength band excluded from the wavelength region of the fluorescence that the resin 20 emits and included in the wavelength region that the base substance 21 emits by irradiation with the excitation light.SELECTED DRAWING: Figure 1
申请公布号 JP2016024095(A) 申请公布日期 2016.02.08
申请号 JP20140149126 申请日期 2014.07.22
申请人 FUJITSU LTD 发明人 SAKAI SATORU;NISHIYAMA YOJI;HOKARI MAMORU;ABE TAKAYUKI;OKADA HIDEO;MARUYAMA KAZUNORI;INOTANI NOBUHIKO
分类号 G01N21/64 主分类号 G01N21/64
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