| 摘要 |
PROBLEM TO BE SOLVED: To provide a material for protecting a semiconductor element which can obtain a cured product excellent in coating properties, heat dissipation and flexibility, and can adequately protect a semiconductor element.SOLUTION: A material for protecting a semiconductor element is a material for protecting a semiconductor element which is used by being applied onto the surface of the semiconductor element so as to protect the semiconductor element contains a flexible epoxy compound, an epoxy compound different from the flexible epoxy compound, a curing agent which is a liquid at 23°C, a curing accelerator, and an inorganic filler which has thermal conductivity of 10 W/m K or more and has a spherical shape.SELECTED DRAWING: Figure 1 |
