| 摘要 |
PROBLEM TO BE SOLVED: To reduce contamination of a chamber.SOLUTION: A substrate processing apparatus includes: a substrate holding unit which rotates a substrate W in a rotation direction Dr while holding the substrate W in a horizontal posture; a chemical nozzle 35 including a discharge port 43a for discharging a chemical solution, which has a temperature higher than a boiling point of water and contains water, toward an application position P1 on an upper surface of the substrate W; a diffusion prevention cover 50 which is disposed above the substrate W so that the application position P1 and the discharge port 43a are covered by an inner surface 51 in a plan view and is smaller than the substrate W in the plan view; a suction pipeline 67 which suctions a fluid in the diffusion prevention cover 50 from a suction port 66 opening on the inner surface 51 of the diffusion prevention cover 50; and a chemical nozzle movement unit which horizontally moves the chemical nozzle 35 with the diffusion prevention cover 50.SELECTED DRAWING: Figure 7 |
