| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure capable of preventing short-circuiting of a circuit even in the case where electrodes are positionally displaced, and the connection structure.SOLUTION: In a manufacturing method of a connection structure, an anisotropic conductive film 11 in which conductive particles P are unevenly distributed at one surface side is used and disposed in such a manner that the surface on which the conductive particles P are unevenly distributed is directed to the side of a first circuit member 2, and the first circuit member 2 and a second circuit member 3 are thermally compression-bonded. Thus, during the thermal compression bond, the conductive particles P not contributing to an electrical connection between a bump electrode 6 and a circuit electrode 8 are unevenly distributed on the first circuit member 2 side between neighboring bump electrodes 6 and 6 which are thicker than the circuit electrode 8. Accordingly, even when the bump electrode 6 is positionally displaced with respect to the circuit electrode 8, the circuit electrode 8 and the other neighboring bump electrode 6 can be prevented from being electrically connected by the conductive particles P, so that short-circuiting of a circuit can be restrained.SELECTED DRAWING: Figure 1 |
