SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which has a low back and a low thermal resistance; and a method for manufacturing the same.SOLUTION: A semiconductor device includes: a support plate 1; a semiconductor chip 2 mounted on one main surface of the support plate 1 through an adhesive layer with an element circuit surface facing up; an insulating material layer 4 sealing the semiconductor chip 2 and the periphery thereof; an opening formed on an electrode arranged on the element circuit surface of the semiconductor chip 2, in the insulating material layer 4; a conductive portion 6 formed in the opening so as to be connected to the electrode of the semiconductor chip 2; a wiring layer 5 that is formed on the insulating material layer 4 so as to be connected to the conductive portion 6, and of which a part extends a peripheral region of the semiconductor chip 2; and an external electrode 7 formed on the wiring layer 5. The support plate 1 is a flat plate constituting the uppermost layer of a composite support plate separated from the composite support plate which is formed by laminating a plurality of flat plates used for a process of manufacturing the semiconductor device.SELECTED DRAWING: Figure 1