| 摘要 |
PROBLEM TO BE SOLVED: To form a groove for shield and a hole for via on a sealing resin without damaging a substrate and wiring on the substrate.SOLUTION: Disclosed is a method of manufacturing an electronic component package in which, on the surface of a sealing resin for sealing an electronic component and an electrode pad arranged and installed on a substrate, a groove or a hole reaching the electrode pad is formed. This method includes: a first step for forming a lower groove or a prepared hole not reaching the electrode pad in a position where the groove or the hole is formed on the surface of the sealing resin by metallic molding; and a second step for exposing the electrode pad by machining to increase the depth of the lower groove or the prepared hole formed in the first step.SELECTED DRAWING: Figure 5 |
