| 摘要 |
PROBLEM TO BE SOLVED: To enhance an unnecessary object removal performance, while suppressing adhesion of particles generated from a brush to a substrate.SOLUTION: In a control method of a substrate processing device 109 including a substrate holding section 202 for rotating a substrate 105 while holding, a brush 302 for processing the substrate 105 by coming into contact therewith, and a cleaning solution supply section 204 supplying a cleaning solution for the substrate, pressing force of the brush 302 to the substrate 109 is controlled by dividing the processing region of the substrate 105 into a first region closest to the substrate center side where the cleaning solution is supplied from the cleaning solution supply section 204, a second region, and a third region closest to the substrate rim side, sequentially from the center position of the substrate, and the pressing force of the second region is set larger than that of the first region and third region.SELECTED DRAWING: Figure 7 |
