| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for improving the film quality of a thin film formed on a substrate.SOLUTION: A semiconductor manufacturing apparatus includes: a substrate transfer mechanism which transfers a plurality of substrates arranged in one line along a conveyance path provided in a first container so as to reach a carry-out port from a carry-in port, and carries the substrates into/out of a second container one by one; and drive parts for driving the substrate transfer mechanism, the drive parts being formed so as to be capable of separated from the substrate transfer mechanism provided in the first container, and being installed in a substrate carry-in chamber and a substrate carry-out chamber, respectively.SELECTED DRAWING: Figure 1 |
