| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition for an optical semiconductor element, which has good releasability while showing no decrease in transparency of a cured product.SOLUTION: A thermosetting epoxy resin composition for encapsulation of an optical semiconductor element is provided, which essentially comprises: (A) a triazine derivative epoxy resin; (B) at least one epoxy resin selected from the group consisting of a bisphenol-A epoxy resin, a bisphenol-F epoxy resin, a hydrogenated bisphenol-A epoxy resin, and an alicyclic epoxy resin; (C) an acid anhydride curing agent; (D) a curing accelerator; and (E) a release agent that is a mixture of a glycerin fatty acid ester, a propylene glycol fatty acid ester, and a higher alcohol fatty acid ester.SELECTED DRAWING: None |
