| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device which improves processing efficiency of a plate-shaped workpiece and, at the same time, prevents attachment of molten material to a lower surface of the plate-shaped workpiece.SOLUTION: A laser processing device (1) includes a chuck table (20) for retaining a plate-like workpiece (W) and laser processing means (50) for applying a laser beam to the plate-like workpiece. Therein, a plurality of suction surfaces (24) capable of individually retaining chips (C) made by dividing the plate-like workpiece with the laser processing means, grooves (23) which divide an upper surface of the chuck table into a plurality of suction surfaces and a security space (25) for securing molten material of a plate-like workpiece on the lower side of the grooves are formed on the chuck table and the width of the groove of the chuck table is wider than a cutting margin of the plate-like workpiece and the width of the security space is formed wider than the width of the groove.SELECTED DRAWING: Figure 3 |
