METHOD FOR DIVIDING BONDED SUBSTRATE AND DIVIDING APPARATUS

摘要

The present invention is to provide a method and an apparatus for appropriately dividing a bonded substrate. A method for dividing a bonded substrate formed by bonding two brittle material substrates at a division-planned position comprises: a scribe line forming process of forming a scribe line at the division-planned position on one main face side of the bonded substrate; a support tape adhering process of adhering a support tape onto one main face of the bonded substrate on which the scribe line is formed; a placement process of placing the bonded substrate to which the support tape is adhered, on an elastic body so that one main face comes in contact with the entire face; and a division process of dividing the bonded substrate by lowering the front end of an upper blade while coming in contact with the division-planned position while the bonded substrate is placed on the elastic body, to extend a crack from the scribe line.