发明名称 MANUFACTURING METHOD OF MASK BLANK, MANUFACTURING METHOD OF PHASE SHIFT MASK AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a mask blank having a phase shift film having high resistance to an exposure light of ArF excimer laser and having reduced film stress.SOLUTION: A method has a phase shift film forming process for forming a phase shift film by forming a high transmission layer and a low transmission layer having relatively lower nitrogen content than the high transmission layer by reactive sputtering in a sputtering gas containing nitrogen-based gas, xenon and helium gas by using a silicon target or a target consisting of a material containing silicon and one or more elements selected from semi-metallic element and non-metallic element, and a heat treatment process for conducting a heat treatment at a temperature of 180°C or more.SELECTED DRAWING: Figure 1
申请公布号 JP2016020950(A) 申请公布日期 2016.02.04
申请号 JP20140143965 申请日期 2014.07.14
申请人 HOYA CORP 发明人 SHISHIDO HIROAKI;EBISAWA MIGAKU;NOZAWA JUN
分类号 G03F1/32;H01L21/027 主分类号 G03F1/32
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