ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, BONDING FILM FOR PRINTED WIRING BOARD, COVERLAY FOR PRINTED WIRING BOARD, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition for a printed wiring board, which can maintain high adhesiveness for a long time in a high temperature environment and has excellent heat resistance, a bonding film for a printed wiring board, a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board.SOLUTION: The adhesive composition for a printed wiring board comprises a siloxane-modified polyimide and an epoxy resin, in which the epoxy resin is included by 1 to 10 parts by mass with respect to 100 parts by mass of the siloxane-modified polyimide. The composition has a sea-island structure in which the siloxane-modified polyimide is regarded as the sea phase while the epoxy resin is regarded as the island phase, and an average diameter of the island phase is 1 μm or less.SELECTED DRAWING: None