发明名称 |
SUBSTRATE REINFORCING STRUCTURE |
摘要 |
A substrate reinforcing structure for preventing and suppressing deformation or the like of a substrate with a fixed electric component socket.;A first reinforcing plate in, for example, a frame shape is attached to a back surface of a wiring board. Further, a second reinforcing plate in, for example, a flat shape is provided on a back side of the first reinforcing plate. In a preferred embodiment of the present invention, a first insulating sheet is further provided between the wiring board and the first reinforcing plate, and a spacer is provided on the second reinforcing plate and abutted to a part of the wiring board where contact pins do not protrude. A second insulating sheet is further provided on the second reinforcing plate. |
申请公布号 |
US2016037627(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
US201414776389 |
申请日期 |
2014.03.06 |
申请人 |
ENPLAS CORPORATION |
发明人 |
UEYAMA Yuki |
分类号 |
H05K1/02;H05K1/11;H05K1/03 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate reinforcing structure used to a substrate including an inserting hole formation area provided with a plurality of contact pin inserting holes, an upper surface of which an electric component socket is installed, and contact pins of the electric component socket are fixed in a state in which the contact pins are inserted to the contact pin inserting holes,
wherein the substrate reinforcing structure comprising:
a first reinforcing plate attached to a lower surface side of the substrate so as to surround the inserting hole formation area; anda second reinforcing plate provided on a lower side of the first reinforcing plate so as to cover an area surrounded by the first reinforcing plate. |
地址 |
Kawaguchi-shi, Saitama JP |