发明名称 SUBSTRATE REINFORCING STRUCTURE
摘要 A substrate reinforcing structure for preventing and suppressing deformation or the like of a substrate with a fixed electric component socket.;A first reinforcing plate in, for example, a frame shape is attached to a back surface of a wiring board. Further, a second reinforcing plate in, for example, a flat shape is provided on a back side of the first reinforcing plate. In a preferred embodiment of the present invention, a first insulating sheet is further provided between the wiring board and the first reinforcing plate, and a spacer is provided on the second reinforcing plate and abutted to a part of the wiring board where contact pins do not protrude. A second insulating sheet is further provided on the second reinforcing plate.
申请公布号 US2016037627(A1) 申请公布日期 2016.02.04
申请号 US201414776389 申请日期 2014.03.06
申请人 ENPLAS CORPORATION 发明人 UEYAMA Yuki
分类号 H05K1/02;H05K1/11;H05K1/03 主分类号 H05K1/02
代理机构 代理人
主权项 1. A substrate reinforcing structure used to a substrate including an inserting hole formation area provided with a plurality of contact pin inserting holes, an upper surface of which an electric component socket is installed, and contact pins of the electric component socket are fixed in a state in which the contact pins are inserted to the contact pin inserting holes, wherein the substrate reinforcing structure comprising: a first reinforcing plate attached to a lower surface side of the substrate so as to surround the inserting hole formation area; anda second reinforcing plate provided on a lower side of the first reinforcing plate so as to cover an area surrounded by the first reinforcing plate.
地址 Kawaguchi-shi, Saitama JP