| 发明名称 |
COMPOSITIONS AND METHODS FOR SELECTIVELY ETCHING TITANIUM NITRIDE |
| 摘要 |
Semi-aqueous compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten and copper, and insulating materials from a microelectronic device having same thereon. The semi-aqueous compositions contain at least one oxidant, at least one etchant, and at least one organic solvent, may contain various corrosion inhibitors to ensure selectivity. |
| 申请公布号 |
US2016032186(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201414772652 |
申请日期 |
2014.03.04 |
| 申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. ;ATMI TAIWAN CO., LTD. |
发明人 |
CHEN Li-Min;COOPER Emanuel I.;LIPPY Steven;SONG Lingyan;HSU Chia-Jung;TU Sheng-Hung;WANG Chieh Ju |
| 分类号 |
C09K13/10;G03F7/42;C09K13/08 |
主分类号 |
C09K13/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composition for selectively removing titanium nitride and/or photoresist etch residue material from the surface of a microelectronic device having same thereon, said composition comprising at least one oxidizing agent, at least one etchant, at least one corrosion inhibitor, and water, wherein the composition is substantially devoid of hydrogen peroxide. |
| 地址 |
Danbury CT US |
