发明名称 MANUFACTURING METHOD OF RESIN COVER INTEGRATED TYPE TOUCH PANEL SENSOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin cover integrated type touch panel sensor substrate with a surface having excellent physical and chemical strength, design property and flexibility.SOLUTION: In a manufacturing method of a resin cover integrated type touch panel sensor substrate, on one face of a carrier substrate, a first transparent resin layer 2 having detachability from the carrier substrate, a frame area 20 formed for dividing from a display area, a second transparent resin layer 8 and an electrostatic capacitance type touch panel sensor layer are sequentially laminated, and then detached.SELECTED DRAWING: Figure 1
申请公布号 JP2016021167(A) 申请公布日期 2016.02.04
申请号 JP20140144851 申请日期 2014.07.15
申请人 TOPPAN PRINTING CO LTD 发明人 SHIBATA YASUHIRO;TAKAMATSU JUNICHI;FUJITA TORU;EMOTO KAZUTAKA
分类号 G06F3/041;G06F3/044 主分类号 G06F3/041
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