发明名称 RESIDENCE-WALL SOUND ABSORPTION/INSULATION STRUCTURE AND ATTACHMENT STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a thin and lightweight structure that can reduce sounds of the low frequency to high frequency, especially can provide a high sound insulation property even in the region about 200 Hz, and is effective for cutting off the vibration of a surface material caused by a sound wave energy.SOLUTION: On both surfaces of a reflective intermediate layer 6, sound absorption layers in which a hard foam material 4 having communication air bubbles is filled into a honeycomb material 5 are disposed so as to form a symmetric structure with respect to the intermediate layer. Porous materials 3 are bonded to both surfaces of each sound absorption layer, thereby forming a panel structure. A reflective surface layer is disposed on each of both surfaces of the panel structure via an air space of a certain thickness.SELECTED DRAWING: Figure 1a
申请公布号 JP2016020941(A) 申请公布日期 2016.02.04
申请号 JP20140143727 申请日期 2014.07.11
申请人 SHIZUKA CO LTD 发明人 TAKE KOICHI
分类号 G10K11/16;E04B1/86 主分类号 G10K11/16
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