INTEGRATED SENSOR MODULES

摘要

An integrated sensor module includes one or more packaged light source semiconductor devices and one or more packaged light detector semiconductor devices mounted to a top surface of a substrate. A pre-molded cover structure includes a portion molded from an opaque molding compound and a further portion molded from a light transmissive molding compound. For each of the packaged light source and light detector semiconductor devices, the pre-molded cover structure includes a pre-molded cavity covered by a window formed of the light transmissive molding compound. The pre-molded cover structure is attached to the substrate such that each of the packaged light source and light detector semiconductor devices fits within a respective cavity, and such that a barrier formed of the opaque molding compound is positioned between each packaged light source semiconductor device and light detector semiconductor device. The module can also include additional sensors and/or electrodes for use by sensors.

主权项

1. A sensor module, comprising:
a substrate having a top surface and a bottom surface; a packaged light source semiconductor device mounted to the top surface of the substrate, the packaged light source semiconductor device including
a light emitter die including one or more light emitting elements encapsulated by a light transmissive molding compound;a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more light emitting elements;a bottom surface including electrical contacts for the one or more light emitting elements; anda peripheral surface extending between the top and bottom surfaces; a packaged light detector semiconductor device mounted to the top surface of the substrate such that there is a gap between the packaged light detector semiconductor device and the packaged light source semiconductor device, the packaged light detector semiconductor device including
a light detector die including one or more light detecting elements encapsulated by a light transmissive molding compound;a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more light detecting elements;a bottom surface including electrical contacts for the one or more light detecting elements; anda peripheral surface extending between the top and bottom surfaces; a pre-molded cover structure including a portion of which is molded from an opaque molding compound and a further portion of which is molded from a light transmissive molding compound, the pre-molded cover structure including
a first pre-molded cavity covered by a first window formed of the light transmissive molding compound;a second pre-molded cavity covered by a second window formed of the light transmissive molding compound;a barrier formed of the opaque molding compound between the first pre-molded cavity and the second pre-molded cavity; wherein the pre-molded cover structure is attached to the substrate such that the packaged light source semiconductor device is positioned within the first pre-molded cavity, the packaged light detector semiconductor device is positioned within the second pre-molded cavity, the barrier is positioned between the packaged light detector semiconductor device and the packaged light source semiconductor device, the first window covers the one or more light emitting elements of the light emitter die, and the second window covers the one or more light detecting elements of the light detector die.