CURABLE RESIN COMPOSITION, METHOD FOR PREPARING CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING LAMINATE, AND DISPLAY DEVICE

摘要

Provided is a curable resin composition capable of forming a bonding resin layer in which the elasticity of a cured layer is low and which has a low curing shrinkage and is hard to be peeled off. The curable resin composition is one that contains 50 mass% or more of curable oligomer (I), wherein the curable oligomer (I) contains: 1-50 mass% of oligomer (IA) which has curable functional groups comprising one or both of acryloyloxy and methacryloyloxy groups, and has an average number of the curable functional groups being two or more and a number average molecular weight of 15,000-100,000; and 30-95 mass% of oligomer (IB) which has curable functional groups comprising one or both of acryloyloxy and methacryloyloxy groups and urethane bonds, has an average number of the curable functional groups being 0.5-1.5 and a number average molecular weight of 1,300-36,000, and contains 30 mass% or less of components having two curable functional groups.