发明名称 DRIVER UNIT AND ELECTRIC POWER STEERING DEVICE INCLUDING THE DRIVER UNIT
摘要 A driver unit has a rotating electric machine and a frame member that is disposed on one axial end of the rotating electric machine. A substrate is fixed onto one surface of the frame member which faces away from the rotating electric machine. Switching elements constituting inverters for switching power supply to winding groups are mounted on a first surface for enabling heat dissipation toward the frame member. An Integrated Circuit (IC) is mounted on the first surface for enabling heat dissipation toward the frame member. An electronic component is mounted on a second surface at an overlapping position that at least partially overlaps a mounting position of the IC.
申请公布号 US2016036305(A1) 申请公布日期 2016.02.04
申请号 US201514812866 申请日期 2015.07.29
申请人 DENSO CORPORATION 发明人 Kawata Hiroyuki;Yamasaki Masashi
分类号 H02K11/00;B62D5/04;H02P25/22 主分类号 H02K11/00
代理机构 代理人
主权项 1. A driver unit comprising: a rotating electric machine having a stator on which a winding is wound, a rotor rotatably disposed relative to the stator, and a shaft that rotates together with the rotor; a frame member disposed on one axial end of the rotating electric machine; a substrate fixed on an opposite side of the frame member relative to the rotating electric machine; a driver element comprising an inverter for switching an electric current supplied to the winding, the driver element mounted on a first surface of the substrate facing the frame member for dissipating heat to the frame member; an Integrated Circuit (IC) component disposed on the first surface for dissipating heat to the frame member, the IC component including at least one of a pre-driver that outputs a drive signal to the driver element, a regulator that regulates a voltage of a power source and outputs the regulated voltage, and a signal amplifier for amplifying an input signal; and an electronic component mounted on a second surface that is opposite to the first surface of the substrate, a position of the electronic component on the second surface positioned at least partially overlapping with a position of the IC component.
地址 Kariya-city JP
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