发明名称 HIGH PRECISION HIGH RELIABILITY AND QUICK RESPONSE THERMOSENSITIVE CHIP AND MANUFACTURING METHOD THEREOF
摘要 The present invention relates to the technical field of thermosensitive chip products. Provided are a high precision high reliability and quick response thermosensitive chip and manufacturing method thereof, comprising a thermosensitive ceramic semiconductor substrate (1); glass protective layers (2) are alternately spray-coated and sintered on the two surfaces of the thermosensitive ceramic semiconductor substrate (1); and the two surfaces of the thermosensitive ceramic semiconductor substrate (1) having the glass protective layers (2) are printed with metal electrode layers (3). The thermosensitive chip achieves quick response, accurate control of resistance precision and has high precision; in addition, the glass protective layers thereof enable the thermosensitive chip to have high reliability.
申请公布号 WO2016015594(A1) 申请公布日期 2016.02.04
申请号 WO2015CN84974 申请日期 2015.07.23
申请人 EXSENSE ELECTRONICS TECHNOLOGY CO., LTD 发明人 CHEN, WENTING;DUAN, ZHAOXIANG;YANG, JUN;BAI, QIXING;TANG, LIMIN;YE, JIANKAI
分类号 G01K7/22;H01C7/04 主分类号 G01K7/22
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