| 发明名称 |
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATION METHOD |
| 摘要 |
The present invention provides a chip integration module, including a die, a passive device, and a connecting piece, where the die is provided with a die bonding portion, the passive device is provided with a passive device bonding portion, the die bonding portion of the die and the passive device bonding portion of the passive device are disposed opposite to each other, and the connecting piece is disposed between the die bonding portion and the passive device bonding portion and is connected to the die bonding portion and the passive device bonding portion. The chip integration module of the present invention achieves easy integration and has low costs. Moreover, a path connecting the die to the passive device becomes shorter, which can improve performance of the passive device. The present invention further discloses a chip package structure and a chip integration method. |
| 申请公布号 |
US2016035689(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514810043 |
申请日期 |
2015.07.27 |
| 申请人 |
HUAWEI TECHNOLOGIES CO., LTD. |
发明人 |
FU Huili;GAO Song |
| 分类号 |
H01L23/00;H01L23/31;H05K13/04;H01L25/16 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip integration module, comprising a die, a passive device, and a connecting piece, wherein the die is provided with a die bonding portion, the passive device is provided with a passive device bonding portion, the die bonding portion of the die and the passive device bonding portion of the passive device are disposed opposite to each other, and the connecting piece is disposed between the die bonding portion and the passive device bonding portion, and is connected to the die bonding portion and the passive device bonding portion. |
| 地址 |
Shenzhen CN |
