| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate having excellent characteristics such as a low dielectric constant, a low dielectric loss tangent, and a low transmission loss and having high reliability, and to provide a printed circuit board using the same.SOLUTION: A fluorine resin-containing aqueous polyimide precursor composition of the present invention comprises an aqueous polyimide precursor, a fluorine resin, and water, where the aqueous polyimide precursor, the fluorine resin, and the water are mixed uniformly. Furthermore, a laminate of the present invention comprises a resin layer, a fluorine resin-containing polyimide layer, and a metal layer, where the resin layer and the metal layer are joined via the fluorine resin-containing polyimide layer, the fluorine resin-containing polyimide layer is formed by mixing a polyimide component and a fluorine resin component uniformly, and the fluorine resin-containing polyimide layer is formed by using the fluorine resin-containing aqueous polyimide precursor composition of the present invention.SELECTED DRAWING: None |
