| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for electrically connecting a commercial semiconductor component having re-melting solder disposed on the functional surface side thereof to a wiring board while solder flash is prevented when the commercial semiconductor component is mounted on the wiring board, and a manufacturing method for the structure.MEANS FOR SOLVING THE PROBLEM: A component mounting and wiring board has a wiring board having an electrode terminal disposed on the principal surface side thereof, a semiconductor component disposed so that the functional surface thereof and the principal surface of the wiring board confront each other, and a solder member for electrically connecting the electrode terminal of the wiring board and the functional surface of the semiconductor component. The solder member comprises two layers of re-melting solder located at the functional surface side of the semiconductor component and melting-point increasing solder located at the electrode terminal side of the wiring board, and the melting-point increasing solder covers the whole of the re-melting solder.SELECTED DRAWING: Figure 2 |
