WIRING BOARD

摘要

In the wiring board of the present invention, the land pattern for power supply, connected to the semiconductor element connection pad for power supply through a via conductor and arranged below the segment region, includes a strip-shaped continued portion in the position corresponding to the outer peripheral portion except the outer peripheral side of the mounting portion in the segment region, and the strip-shaped continued portion and the power supply plane arranged therebelow are connected through a via conductor.

主权项

1. A wiring board comprising:
a mounting portion including an upper surface on which a semiconductor element is to be mounted; a segment region arranged in an outer peripheral portion of the mounting portion, the segment region including a semiconductor element connection pad for power supply, a semiconductor element connection pad for grounding, and a semiconductor element connection pad for signal forming a plurality of columns lined up along an outer periphery side of the mounting portion and being intermixed; among a plurality of the columns, an innermost side column and an outermost side column being formed by the semiconductor element connection pad for grounding, and at least one column positioned between the innermost side column and the outermost side column being formed by the semiconductor element connection pad for power supply; a first lower layer conductor layer arranged below the segment region; the first lower layer conductor layer including:
a land pattern for power supply being connected to the semiconductor element connection pad for power supply through a via conductor;a signal wiring pattern being connected to the semiconductor element connection pad for signal through a via conductor, the signal wiring pattern extending to an outside of the mounting portion; anda grounding plane to which the semiconductor element connection pad for grounding being connected through a via conductor, the grounding plane extending to an outside of the mounting portion; a second lower layer conductor layer arranged below the first lower layer conductor layer; and the second lower layer conductor layer including a power supply plane connected to the land pattern for power supply through a via conductor, wherein the land pattern for power supply includes a strip-shaped continued portion in a position corresponding to an outer peripheral portion except an outer periphery side of the mounting portion in each of the segment regions, and wherein the strip-shaped continued portion and the power supply plane are connected through a via conductor.