| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a light emission unit that can selectively form different a series connection loop, a parallel connection loop or a series and parallel connection loop by a cutoff process.SOLUTION: A semiconductor structure 110 containing plural light emission dices 120 which are separated from one another is provided. A molding compound 130 is formed to capsulate the light emission dices 120. Each light emission dice 120 contains a light emission element, a first electrode 124 and a second electrode 126. A pattern metal layer 140 is formed on the first electrode 124 and the second electrode 126 of the light emission dice 120, and a board is further provided. The molding compound 130 is disposed between the board of the light emission dice 120 and the light emission element. A cutoff process is performed to cut off the semiconductor structure 110, the pattern metal layer 140, the molding compound 130 and the board, and the light emission unit is defined by a series connection loop, a parallel connection loop or a series parallel connection loop.SELECTED DRAWING: Figure 3 |
