| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
The object of the present invention is to provide a printed circuit board formed with a cavity to mount a semiconductor chip. |
| 申请公布号 |
US2016037646(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514817418 |
申请日期 |
2015.08.04 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Yong Jik;SUNG Jung Kyung;KOO Bong Wan;LIM Hyun Duck |
| 分类号 |
H05K1/18;H05K1/11;H05K1/02;H05K3/00;H05K3/28;H05K3/46;H01L23/538;H05K3/42 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
a core substrate; a first insulation layer stacked on the core substrate; a via formed on a surface of the first insulation layer and a pad formed on a bottom surface of the via; a form maintenance prepreg layer stacked on a surface of the insulation layer; and a second insulation layer formed on a surface of the form maintenance prepreg layer, wherein a cavity is formed on the form maintenance prepreg layer and the second insulation layer to expose a top surface of the first insulation layer and the via. |
| 地址 |
Suwon-si KR |
