发明名称 FLUORESCENT COMPOSITE RESIN SUBSTRATE WHITE LIGHT LIGHT EMITTING DIODE
摘要 A fluorescent composite resin substrate white light LED includes a fluorescent composite resin substrate, two conductive brackets, a light emitting unit, two conductive lines and a package material. The fluorescent composite resin substrate is formed from a mixture through a curing reaction. Each of the conductive brackets is partially connected to the substrate. The light emitting unit is disposed on the substrate. The conductive lines are connected to the light emitting unit and respectively connected to the conductive brackets. The package material is formed from a mixture through a curing reaction. By fixing the light emitting unit at the fluorescent composite resin substrate, when applied to white light LED operations, the present invention achieves effects of emitting light through six planes, having high light flux and good heat dissipation, and significantly increasing production yield rate and speed without incurring different color temperatures at front and reverse sides.
申请公布号 US2016035943(A1) 申请公布日期 2016.02.04
申请号 US201514694899 申请日期 2015.04.23
申请人 KAO Yu-Yu 发明人 KAO Yu-Yu
分类号 H01L33/50;H01L33/48;H01L33/62 主分类号 H01L33/50
代理机构 代理人
主权项 1. A fluorescent composite resin substrate white light light emitting diode (LED), comprising: a fluorescent composite resin substrate, formed from a mixture through a curing reaction, the mixture forming the fluorescent composite resin substrate including composite resin, a hardening agent and a fluorescent material; two conductive brackets, each of the conductive brackets partially connected to the fluorescent composite resin substrate; a light emitting unit, disposed on a surface of the fluorescent composite resin substrate; two conductive lines, connected to the light emitting unit and respectively connected to the conductive brackets; a package material, formed from a mixture through a curing reaction, the mixture of the package material including curable resin, a hardening agent and a fluorescent material; wherein the package material covers and seals conductive lines and the light emitting unit to form a finished product of the fluorescent composite resin substrate white light LED; and a lower plate, for placing the fluorescent composite resin substrate, the two conductive brackets, the light emitting unit, the two conductive lines and the package material.
地址 Taipei City TW