发明名称 OXYGEN CONTROLLED PVD ALN BUFFER FOR GAN-BASED OPTOELECTRONIC AND ELECTRONIC DEVICES
摘要 Oxygen controlled PVD AlN buffers for GaN-based optoelectronic and electronic devices is described. Methods of forming a PVD AlN buffer for GaN-based optoelectronic and electronic devices in an oxygen controlled manner are also described. In an example, a method of forming an aluminum nitride (AlN) buffer layer for GaN-based optoelectronic or electronic devices involves reactive sputtering an AlN layer above a substrate, the reactive sputtering involving reacting an aluminum-containing target housed in a physical vapor deposition (PVD) chamber with a nitrogen-containing gas or a plasma based on a nitrogen-containing gas. The method further involves incorporating oxygen into the AlN layer.
申请公布号 US2016035937(A1) 申请公布日期 2016.02.04
申请号 US201514884251 申请日期 2015.10.15
申请人 Zhu Mingwei;Patibandla Nag B.;Wang Rongjun;Diehl Daniel Lee;Agrawal Vivek;Subramani Anantha 发明人 Zhu Mingwei;Patibandla Nag B.;Wang Rongjun;Diehl Daniel Lee;Agrawal Vivek;Subramani Anantha
分类号 H01L33/12;H01L29/20;H01L33/00;H01L31/18 主分类号 H01L33/12
代理机构 代理人
主权项 1. A method of forming an aluminum nitride (AlN) buffer layer for GaN-based optoelectronic or electronic devices, the method comprising: reactive sputtering an AlN layer above a substrate, the reactive sputtering comprising reacting an aluminum-containing target housed in a physical vapor deposition (PVD) chamber with a nitrogen-containing gas or a plasma based on a nitrogen-containing gas; and incorporating oxygen into the AlN layer.
地址 San Jose CA US