发明名称 |
OXYGEN CONTROLLED PVD ALN BUFFER FOR GAN-BASED OPTOELECTRONIC AND ELECTRONIC DEVICES |
摘要 |
Oxygen controlled PVD AlN buffers for GaN-based optoelectronic and electronic devices is described. Methods of forming a PVD AlN buffer for GaN-based optoelectronic and electronic devices in an oxygen controlled manner are also described. In an example, a method of forming an aluminum nitride (AlN) buffer layer for GaN-based optoelectronic or electronic devices involves reactive sputtering an AlN layer above a substrate, the reactive sputtering involving reacting an aluminum-containing target housed in a physical vapor deposition (PVD) chamber with a nitrogen-containing gas or a plasma based on a nitrogen-containing gas. The method further involves incorporating oxygen into the AlN layer. |
申请公布号 |
US2016035937(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
US201514884251 |
申请日期 |
2015.10.15 |
申请人 |
Zhu Mingwei;Patibandla Nag B.;Wang Rongjun;Diehl Daniel Lee;Agrawal Vivek;Subramani Anantha |
发明人 |
Zhu Mingwei;Patibandla Nag B.;Wang Rongjun;Diehl Daniel Lee;Agrawal Vivek;Subramani Anantha |
分类号 |
H01L33/12;H01L29/20;H01L33/00;H01L31/18 |
主分类号 |
H01L33/12 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming an aluminum nitride (AlN) buffer layer for GaN-based optoelectronic or electronic devices, the method comprising:
reactive sputtering an AlN layer above a substrate, the reactive sputtering comprising reacting an aluminum-containing target housed in a physical vapor deposition (PVD) chamber with a nitrogen-containing gas or a plasma based on a nitrogen-containing gas; and incorporating oxygen into the AlN layer. |
地址 |
San Jose CA US |