SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

An object is to provide a thin film transistor using an oxide semiconductor layer, in which contact resistance between the oxide semiconductor layer and source and drain electrode layers is reduced and electric characteristics are stabilized. Another object is to provide a method for manufacturing the thin film transistor. A thin film transistor using an oxide semiconductor layer is formed in such a manner that buffer layers having higher conductivity than the oxide semiconductor layer are formed over the oxide semiconductor layer, source and drain electrode layers are formed over the buffer layers, and the oxide semiconductor layer is electrically connected to the source and drain electrode layers with the buffer layers interposed therebetween. In addition, the buffer layers are subjected to reverse sputtering treatment and heat treatment in a nitrogen atmosphere, whereby the buffer layers having higher conductivity than the oxide semiconductor layer are obtained.

主权项

1. A method for manufacturing a semiconductor device, comprising the steps of:
forming a gate electrode layer over a substrate; forming a gate insulating layer over the gate electrode layer; forming a first oxide semiconductor film over the gate insulating layer, using a sputtering method; subjecting the first oxide semiconductor film to heat treatment; forming a second oxide semiconductor film over the first oxide semiconductor film using a sputtering method; subjecting the second oxide semiconductor film to reverse sputtering treatment; subjecting the second oxide semiconductor film to heat treatment in a nitrogen atmosphere; etching the first oxide semiconductor film and the second oxide semiconductor film to form an oxide semiconductor layer and a first buffer layer; forming a conductive film over the oxide semiconductor layer and the first buffer layer; etching the conductive film and the first buffer layer to form source and drain electrode layers, a second buffer layer, and a third buffer layer; and subjecting the oxide semiconductor layer to heat treatment, wherein the second buffer layer and the third buffer layer have higher conductivity than the oxide semiconductor layer.