HOT-MELT ADHESIVE COMPOSITION AND METHOD FOR PREPARING THE SAME, HOT-MELT ADHESIVE THERMAL CONDUCTIVE SHEET AND METHOD FOR PREPARING THE SAME

摘要

The present invention provides a hot melt adhesive composition and a preparation method therefor, and a hot melt adhesive heat-conducting sheet and a preparation method therefor on a basis of the hot melt adhesive composition. The hot melt adhesive composition at least comprises: 6 to 9 parts of thermoplastic resin, 0.40 to 0.60 parts of tackifier, and 73 to 110 parts of heat-conducting particles by weight, the softening point of the thermoplastic resin ranging from 85 to 120 degrees centigrade. Because the softening point temperature of the thermoplastic resin is higher, the softening point temperature of the prepared hot melt adhesive composition is also higher, and accordingly, the heat-conducting sheet prepared by using the hot melt adhesive composition does not flow and deform in an ordinary temperature, thereby overcoming the defects of easily flowing and deforming in the prior art; in addition, the heat-conducting sheet provided in the present invention has a smaller thickness, thereby improving heat-conducting performance of the heat-conducting sheet.

主权项

1. A hot-melt adhesive composition, characterized in that it at least comprises:
6-9 parts by weight of a thermoplastic resin, which thermoplastic resin has a softening point between 85 and 120° C.; 0.40-0.60 parts by weight of a tackifier; 73-110 parts by weight of thermal conductive particles.