| 摘要 |
A chip integration module (10), comprising a die (11), a passive device (13), and connectors (15); the die (11) is provided with die coupling portions (110); the passive device (13) is provided with passive device coupling portions (130); the die coupling portions (110) of the die (11) and passive device coupling portions (130) of the passive device (13) are positioned opposite one another; the connectors (15) are provided between the die coupling portions (110) and the passive device coupling portions (130) and are connected to the die coupling portions (110) and to the passive device coupling portions (130). The chip integration module (10) allows for easy integration and is low in cost. The connectivity path between the die (11) and the passive device (13) is short, thereby improving passive device performance. A chip encapsulation structure and a chip integration method are also disclosed. |
