PRODUCTION OF A DEVICE HAVING A STRIP-TYPE LEADFRAME

摘要

The invention relates to a method for producing a device. The method comprises the provision of a strip-type leadframe. The leadframe has leadframe portions arranged in a row alongside one another and connecting structures connecting the leadframe portions, said connecting structures each connecting two adjacent leadframe portions. The method furthermore comprises the formation of moulded bodies on the leadframe, which each mechanically connect two adjacent leadframe portions. Also provided are the arrangement of semiconductor chips on the leadframe, and the interruption of the connections, brought about via the connecting structures, of the leadframe portions. The invention also relates to a device.