| 摘要 |
PROBLEM TO BE SOLVED: To provide a base film usable to a self-adhesive film for a semiconductor manufacturing process, which is superior in heat resistance and enables the decrease in various troubles owing to exudation of a low-molecular weight component while keeping its flexibility and restorability.SOLUTION: A base film usable to a self-adhesive film for a semiconductor manufacturing process comprises a polyolefin-based resin (A), and has a tensile elasticity of 200 MPa or less. The polyolefin-based resin (A) has a melting peak temperature (Tm) at least between 140 and 170°C, of which the crystal melting heat quantity (&Dgr;Hm) is 25 J/g or less.SELECTED DRAWING: None |
